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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 31 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 dc brushless fan motor drivers multifunction single-phase full-wave fan motor driver BD6994FV general description BD6994FV is a 1chip driver for 12v single-phase full-wave fan motor. this ic employs the bi -cmos process and incorporates various functions such as low on resistance, low power consumption and quiet drive. features ? ssop small package ? btl soft switching drive ? stand-by function ? speed controllable by dc / pulse i nput ? quick start ? duty control start-up functi on ? lock protection and automatic restart (without external capacitor) ? rotation speed pulse signal (fg) output ? lock alarm signal(al) output key specifications ? operating voltage range: 4.5v to 17v ? operating temperature range: - 40 c to +105c ? output voltage (total): 0.6v(typ) at 0.4a package ssop-b16 w (typ) x d (typ) x h (max) 5.00mm x 6.40mm x 1.35mm application ? fan motors for general consumer equipment of desktop pc, projec tor, etc. absolute maximum ratings paramet er symbol limit unit supply voltage v cc 20 v power dissipation pd 0.87 (note 1) w operating temperature range topr - 40 to +105 c storage temperature range tstg - 55 to +150 c output voltage v o 20 v output current i o 1.2 (note 2) a signal(fg/al) o ut put voltage v fg /v al 20 v signal(fg/al) output current i fg /i al 10 ma reference voltage(ref) output current i ref 5 ma hall bias(hb) output current 1 i hb1 12 (note 3) ma hall bias(hb) output current 2 i hb2 5 (note 4) ma input voltage(h+, h C , th, min, sel, ps) v in 7 v junction temperature tjmax 150 c (note 1) derate by 7.0mw/c if operating over ta=25c. (on 70.0mm70.0mm1.6mm glass epoxy board) (note 2) do not exceed pd and tjmax. (note 3) ta=0c or higher. (note 4) less than ta=0 c . caution: operating the ic over the absolute maximum ratings may dam age the ic. the damage can either be a short circuit between pi ns or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case th e ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol limit unit operating supply voltage range v cc 4.5 to 17.0 v operating input voltage range 1(h+, h C ) (v cc 9v) v in 1 0 .4 to 3 v operating input voltage range 1(h+, h C ) (v cc <9v) 0 .4 to v cc /3 v operating input voltage range 2(th, min) v in 2 0. 4 to v ref v ssop-b16 datashee t downloaded from: http:///
2/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 pin configuration pin description p/no. p/name function 1 gnd ground pin 2 out2 motor output 2 pin 3 vcc power supply pin 4 min minimum output duty setting pin 5 th output duty controllable input pin 6 osc oscillating capacitor connecting pin 7 fg speed pulse signal output pin 8 al lock alarm signal output pin 9 h+ hall + input pin 10 hb hall bias pin 11 h C hall - input pin 12 ref reference voltage output pin 13 sel duty control start up function selecting pin 14 ps power save pin 15 out1 motor output 1 pin 16 gnd ground pin block diagram i/o truth table hall input driver output h+ h C out1 out2 fg h l l h hi -z l h h l l h; high, l; low, hi-z; high impedance fg output is open-drain type. motor state fg output al output rotating - l locking - hi -z stand- by hi -z l l; low, hi-z; hig h impedance al output is open-drain type. v cc th ps fg sel out1 gnd hb osc out2 h C gnd min al 1 2 3 4 5 6 7 15 h+ ref 16 8 14 13 12 11 9 10 figure 2. block diagram figure 1. pin configuration (top view) hall a mp hall comp 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby min th fg osc vcc out2 gnd al out1 hb h C ref sel gnd h+ ps downloaded from: http:///
3/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 electrical characteristics (unless otherwise specified, ta=25c, v cc =12v) parameter symbol limit unit conditions min typ max circuit current i cc - 6.5 9.5 ma circuit current(stand-by) i stby 70 160 250 a ps=0v hall bias voltage v hb 1.05 1.25 1.45 v i hb =-2ma hall input offset voltage v ofs - - 8 mv input-output gain g io 46.0 48.5 51.0 db output voltage v o - 0.6 0.9 v i o = 400 ma high and low side total lock detection on time t on 0.3 0.5 0.7 s lock detection off time t off 3.0 5.0 7.0 s lock detection off/on ratio r lck 8.5 10 11.5 - r lck =t off / t on fg hysteresis voltage v hys 7 12 17 mv fg output low voltage v fgl - 0.2 0.3 v i fg = 5 ma fg output leak current i fgl - - 10 a v fg =17v al output l ow voltage v all - 0.2 0.3 v i al =5 ma al output leak current i all - - 10 a v al =17v osc frequency(reference data) f osc - 26 - khz c osc =100pf osc charge current i cosc - 16 - 11 -6 a osc discharge current i dosc 6 11 16 a osc h igh voltage v osch 3.4 3.6 3.8 v osc low voltage v oscl 1.3 1.5 1.7 v output on duty 1 d oh1 70 80 90 % v th =1.8v output 1k load output on duty 2 d oh 2 40 50 60 % v th =2.4v output 1k load output on duty 3 d oh 3 10 20 30 % v th =3.1v output 1k load re -circulate ratio(reference data) r rc - 50 - % v th =1.65v reference voltage v ref 4.8 5.1 5.4 v i ref =-2ma th input bias current i th -0.6 - - a v th =0.2v min input bias current i min -0.6 - - a v min =0.2v sel input open voltage v sel 2.9 3.2 3.5 v sel input low level v sell -0.3 - 0.8 v sel input bias current i sel - 35 - 25 - 15 a v sel =0v ps input open voltage v ps 4.2 4.7 5.2 v ps input low level v psl -0.3 - 0.8 v ps input high level v psh 2.5 - 5.5 v ps input bias current i ps - 35 - 25 - 15 a v ps =0v limit on duty at start- up d ohl 43 53 63 % v sel =0v , v th v ref -0.1v start assist duty 2 d ohs2 43 53 53 % sel=open, v th >v ref -0.1v for parameters involving current, positive nations means inflow of current to ic wh ile negative nation means outflow of current from ic. the reference data is a design guaranteed value and the numer ical all shipment inspection off the subject item. downloaded from: http:///
4/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) figure 3. circuit current vs supply volt age (in operation) figure 4. circuit current vs supply voltage (in standby) figure 5. hall bias voltage vs supply voltage (i hb =-2ma) 0 2 4 6 8 10 0 5 10 15 20 supply voltage: v cc [v] circuit current: i cc [ma] - 40 c 10 5c 25 c operating voltage range 0 100 200 300 400 0 5 10 15 20 supply voltage: v cc [v] circuit current: i stby [a] - 40 c 10 5c 25 c operating voltage range figure 6. hall bias voltage vs hb source current (v cc =12v) 1.05 1.15 1.25 1.35 1.45 0 5 10 15 20 supply voltage: v cc [v] hall bias voltage: v hb [v] - 40 c 10 5c 25 c 1.05 1.15 1.25 1.35 1.45 0 2 4 6 8 10 hb source current: i hb [ma] hall bias voltage: v hb [v] - 40 c 10 5c 25 c operating voltage range downloaded from: http:///
5/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) - continued figure 9. output high voltage vs output source current (v cc =12v) figure 8. input-output gain vs supply voltage figure 7. hall input offset voltage vs supply voltage -10 -5 0 5 10 0 5 10 15 20 supply voltage: v cc [v] hall input offset voltage: v ofs [v] - 40 c 10 5c 25 c -1.2 -0.8 -0.4 0 0 0.4 0.8 1.2 output source current: i o [a] output high voltage: v oh [v] - 40 c 10 5c 25 c -1.2 -0.8 -0.4 0 0 0.4 0.8 1.2 output source current: i o [a] output high voltage: v oh [v] 4.5v 17v 12v 46 47 48 49 50 51 0 5 10 15 20 supply voltage: v cc [v] input-output gain: g io [db] - 40 c 10 5c 25 c operating voltage range operating voltage range figure 10. output high voltage vs output source current (ta=25c) downloaded from: http:///
6/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) - continued 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 supply voltage: v cc [v] lock detection on time: t on [s] figure 14. lock detection off time vs supply voltage figure 11. output low voltage vs output sink current (v cc =12v) figure 12. output low voltage vs output sink current (ta=25c) figure 13. lock detection on time vs supply voltage 3.0 4.0 5.0 6.0 7.0 0 5 10 15 20 supply voltage: v cc [v] lock detection off time: t off [s] - 40 c 10 5c 25 c 0 0.2 0.4 0.6 0.8 1 0 0.4 0.8 1.2 output sink current: i o [a] outpur low voltage: v ol [v] - 40 c 10 5c 25 c 0 0.2 0.4 0.6 0.8 1 0 0.4 0.8 1.2 output sink current: i o [a] output low voltage: v ol [v] 4.5v 17v 12v - 40 c 10 5c 25 c operating voltage range operating voltage range downloaded from: http:///
7/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) - continued -60 -40 -20 0 20 40 60 0 5 10 15 20 supply voltage: v cc [v] fg hystresis voltage: v hys [v] 0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] 4.5v 17v 12v figure 18. fg output voltage vs fg sink current (ta=25c) 0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] - 40 c 10 5c 25 c figure 17. fg output low voltage vs fg sink current (v cc =12v) figure 16. fg hysteresis voltage vs supply voltage figure 15. lock detection off/on ratio vs supply voltage 8.0 9.0 10.0 11.0 12.0 0 5 10 15 20 supply voltage: v cc [v] lock detection off/on ratio: r lck [s/s] - 40 c 10 5c 25 c - 40 c 10 5c 25 c 10 5c 25 c - 40 c operating voltage range operating voltage range downloaded from: http:///
8/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) - continued -0.2 0 0.2 0.4 0.6 0.8 0 5 10 15 20 al voltage: v al [v] al output leak current: i all [a] 0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 al sink current: i al [ma] al output low voltage: v all [v] - 40 c 10 5c 25 c figure 22. al output leak current vs al voltage 4.5v 17v 12v figure 21. al output low voltage vs al sink current (ta=25c) vs ??R 0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 al sink current: i al [ma] al output low voltage: v all [v] - 40 c 10 5c 25 c figure 20. al output low voltage vs al sink current (v cc =12v) -2 0 2 4 6 8 0 5 10 15 20 fg voltage: v fg [v] fg output leak current: i fgl [a] operating voltage range - 40 c 10 5c 25 c figure 19. fg output leak current vs fg voltage operating voltage range downloaded from: http:///
9/ 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) C continued 0.5 1.5 2.5 3.5 4.5 0 5 10 15 20 supply voltage: v cc [v] osc high/low voltage: v osch /v oscl [v] 10 5c 25 c - 40 c 0 25 50 75 100 0 1 2 3 4 th voltage: v th [v] re-circulate ratio: r rc [%] 10v 14v 12v - 40 c 10 5c 25 c figure 26. re-circulate ratio vs th voltage (reference data; ta=25c) pf figure 23. osc frequency vs supply voltage reference data; c osc =100pf -40 -20 0 20 40 0 5 10 15 20 supply voltage: v cc [v] osc charge/discharge current: i cosc /i dosc [a] operating voltage range - 40 c 10 5c 25 c figure 24. osc charge/discharge current vs supply voltage 10 5c 25 c - 40 c figure 25. osc high/low voltage vs supply voltage 0 10 20 30 40 50 0 5 10 15 20 supply voltage: v cc [v] osc frequency: f osc [khz] - 40 c 10 5c 25 c osc width operating voltage range operating voltage range downloaded from: http:///
10 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) C continued 0 25 50 75 100 0 5 10 15 20 supply voltage: v cc [v] re-circulate ratio: r rc [%] 4 4.5 5 5.5 6 0 2 4 6 8 10 ref source current: i ref [ma] reference voltage: v ref [v] - 40 c 10 5c 25 c figure 29. reference volta ge vs ref source current (v cc =12v) figure 27. re -circulate ratio vs supply voltage reference data; v th =1.65v) -0.60 -0.45 -0.30 -0.15 0.00 0 5 10 15 20 supply voltage: v cc [v] th bias current: i th [a] operating voltage range - 40 c 10 5c 25 c figure 30. th bias current vs supply voltage figure 28. reference voltage vs supply voltage (i ref =-2ma) - 40 c 10 5c 25 c 2.0 3.0 4.0 5.0 6.0 0 5 10 15 20 supply voltage: v cc [v] reference voltage: v ref [v] - 40 c 10 5c 25 c operating voltage range operating voltage range downloaded from: http:///
11 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) C continued -0.60 -0.45 -0.30 -0.15 0.00 0 5 10 15 20 supply voltage: v cc [v] min bias current: i min [a] operating voltage range - 40 c 10 5c 25 c figure 31. min bias current vs supply voltage 2 2.5 3 3.5 4 0 5 10 15 20 supply voltage: v cc [v] sel input open voltage: v sel [v] operating voltage range - 40 c 10 5c 25 c figure 32. sel input open voltage vs supply voltage 0.8 1.1 1.4 1.7 2 0 5 10 15 20 supply voltage: v cc [v] sel input threshold voltage: v sell [v] operating voltage range - 40 c 10 5c 25 c figure 33. sel input threshold voltage vs supply voltage -30 -25 -20 -15 -10 -5 0 5 10 15 20 supply voltage: v cc [v] sel input bias current: i sel [a] operating voltage range - 40 c 10 5c 25 c figure 34. sel input bias current vs supply voltage downloaded from: http:///
12 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) C continued -50 -40 -30 -20 -10 0 5 10 15 20 supply voltage: v cc [v] ps input bias current: i ps [a] 2 3 4 5 0 5 10 15 20 supply voltage: v cc [v] ps input open voltage: v ps [v] - 40 c 10 5c 25 c figure 37. ps input bias current vs supply voltage figure 38. limit on duty time at start- up vs supply voltage 1 1.25 1.5 1.75 2 0 5 10 15 20 supply voltage: v cc [v] ps input high/low threshold voltage: v psh /v psl [v] op erating voltage range - 40 c 10 5c 25 c figure 36. ps input high/low threshold voltage vs supply voltage 10 5c 25 c - 40 c figure 35. ps input open voltage vs supply voltage 40 45 50 55 60 65 0 5 10 15 20 supply voltage: v cc [v] limit on duty at start-up: d oh [%] - 40 c 10 5c 25 c - 40 c 10 5c 25 c operating voltage range operating voltage range operating voltage range downloaded from: http:///
13 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 typical performance curves (reference data) C continued 20 25 30 35 40 45 0 5 10 15 20 supply voltage: v cc [v] start assist duty 1: d ohs1 [%] figure 40. start assist duty 1 vs supply voltage - 40 c 10 5c 25 c operating voltage range figure 39. limit on duty time at start- up vs supply voltage 0.2 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 supply voltage: v cc [v] limit on duty time at startup : t oh [s] - 40 c 10 5c 25 c operating voltage range 40 45 50 55 60 65 0 5 10 15 20 supply voltage: v cc [v] start assist duty 2: d ohs2 [%] figure 41. start assist duty 2 vs supply voltage - 40 c 10 5c 25 c operating voltage range downloaded from: http:///
14 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 application circuit example (constant values are for reference) 1. pwm input application 1(use of stand-by function) this is an example application circuit for converting the external pwm duty into dc voltage, and controlling the rotational speed. substrate design note a) ic power, motor outputs, and motor ground lines are made as wide as possible. b) the bypass capacitor and/or zener diode are connected near t o vcc terminal. c) h+ and h C lines are arranged side by side and connected from the hall e lement to the ic as short as possible, because it is easy for the noise to influence the hall line s. m 0.1 f to 1 f to sig h 0 to 0 to pwm to 10k 0 to sig 100pf to ps (14pin) from pwm terminal hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby b) m sig h ref hb out2 h+ h C al out1 vcc gnd 8 11 10 9 2 16 3 12 15 osc 6 min 4 th 5 a) a) a) pwm a) near to ic c) short lines fg 7 sel 13 1 ps 14 b) m sig h ref hb out2 h+ h C al out1 v cc gnd 8 11 10 9 2 16 3 12 15 osc 6 min 4 th 5 a) a) a) pwm a) far from ic c) long lines fg 7 sel 13 1 ps 14 maximum output voltage and current are 20v and 1.2a. hall bias is set according to the amplitude of hall element output and hall input voltage range. stabilization of ref voltage bypass capacitor, must be connected near to vcc terminal as much as possible circuit that converts pwm duty into dc voltage. take into consideration the operating input voltage range of th terminal. . input bypass capacitor to reduce noise in the input. reverse polarity protection limit on duty at start up setting sel=open: disable sel=10k : enable output pwm frequency setting protection of fg open-drain figure 42. application of converting pwm duty to dc voltage figure 43. bad layout image of the substrate figure 44 . go od layout image of the substrate input pwm signal into ps te rminal. stand-by function can be used . use only push-pull input signal. downloaded from: http:///
15 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 application circuit example (constant values are for reference) 2. dc voltage input application 1 this is an example application circuit for fixed rotation s peed control by dc voltage. in this application, minimum rotational speed cannot be set. moreover, output duty changes depending on the th voltage. function of limit on duty at start up can be set using the sel terminal. 3. dc voltage input application 2 this is an example application circuit for fixed rotation speed control by dc voltage. in this application, output d uty changes depending on the min voltage. function of start duty as sist can be set using the sel terminal. m 0.1 f to 1 f to sig h 0 to 0 to to 10k 0 to sig to 10k 100pf hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby m 0.1 f to 1 f to sig h 0 to 0 to to 10k 0 to sig to 10k 100pf hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby figure 45. application of dc voltage input 1 figure 46. application of dc voltage input 2 set th voltage less than osc high (typ. 3.6v) min terminal is pulled up to ref terminal. the minimum output duty setting is invalid. start duty assist sel=open: 53% sel =10k : 33% min terminal is pulled up to ref terminal. the minimum output duty setting is invalid. th terminal is pulled up to ref terminal. the limit on duty is invalid. limit on duty at start up sel=open: disable sel=10k : enable downloaded from: http:///
16 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 application circuit example (constant values are for reference) 4. dc v ol tage input application 3 (thermistor control application) this is an example application circuit for controlling the rotational speed by ambient temperature. in this app lication, if the thermistor is open, the ic operates at the set minimum rota tional speed. output duty changes depending on the th voltage . function of limit on duty at start up can be set using the sel ter minal. 5. pulse input applicati on (use of stand-by function) this is an example application circuit for inverting the external pwm input, and controlling the rotational spee d. in this application, if the external pwm input is open, the ic operates at the set maximum rotational speed. minimum rotational speed cannot be set. the output duty changes d epending on min. function of start duty assist can be set using the sel terminal. m 0.1 f to 1 f to sig h 0 to 0 to pwm to 10k 0 to sig to 10k 100pf to stby(14pin) from pwm terminal hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby m 0.1 f to 1 f to sig h 0 to 0 to to 10k 0 to sig 100pf hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby figure 48. application of pulse input figure 47. application of thermistor control set min voltage less than osc high (typ. 3.6v) limit on duty at start up sel=open: disable sel=10k : enable linearization correction resistance if necessary. the input voltage is changeable in the ambient temperature set by the thermistor constant. start duty assist sel=open: 53% sel=10k : 33% pwm inversion circuit, take into consideration the operating input voltage range of min terminal. circuit that input direct pwm (ref.) pwm input frequency is 2khz to 50khz. th terminal is pulled up by ref terminal. the limit on duty is invalid. input pwm signal into ps terminal, can use stand-by function. only in the case of push-pull input signal. downloaded from: http:///
17 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 1. variable speed operation the rotating speed changes by pwm duty on the motor outputs (ou t1, out2 terminals). pwm operation can be enabled by dc voltage input in th terminal, and min terminal pulse input in min terminal (1) pwm operation by dc input as shown in figure 51 , to change motor output on duty, dc voltage input from th ter minal is compared with triangle wave produced by internal osc circuit. min terminal is for setting the minimum rotating speed. on duty is determined by either th terminal voltage or min terminal, whiche ver is lower. dividing resistance of the internal regulator generates osc high level (typ. 3.6v) and osc low level (typ. 1.5v) voltage, and the ratio of those voltages is designed to be hard to fluctuate. when the input voltage at th terminal is constant, effect by fluctuation of osc h/l voltag e is large. however, by setting that an application of ref voltage generates input voltage via th, application ca n be made hard to be affected by voltage fluctuation of triangle wave. for an application that requires strict precisio n, determine a value with sufficient margin after taking full consideration of external constant s. (2) pwm operation by pulse input pulse signal can be input to min terminal for pwm operation as shown in figure 53. the on duty of the output changes by the cycle of the input pulse signal. t he th terminal is pull ed -up in the ref terminal. figure 49. dc input application 1 figure 51. dc input operation timing chart figure 53. pulse input operation timing chart figure 52. pulse input application figure 50. dc input application 2 ref out1 th 5 .0 v 1 .5 v 3.6v out2 low high low high low high h+ h C 0.0v gnd zero full motor torque min min. osc motor output on osc osc th pwm comp pwm lpf pwm comp min ref ref min ref out1 th 5 .0 v 1 .5 v 3.6v out2 low high low high low high h+ h C 0.0v gnd low high pwm zero full motor torque osc motor output on osc osc th pwm comp pwm comp min ref ref pwm ref osc osc th pwm comp pwm comp min ref ref downloaded from: http:///
18 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 1. variable speed operation C continued (3) setting of th and min terminals the voltage of the th terminal or min terminal becomes irregular wh en it is open. please apply voltages to both terminals when you turn on ic power supply (v cc ). (4) output oscillatory frequency setting frequency (fosc) in which the motor outputs are operated pw m by dc voltage input is set according to capacity value (cosc) of the capacitor connected with osc terminal. f osc = |i dosc x i cosc |/ (c osc x (|i dosc | + |i cosc |) x (v osch - v oscl )) [hz] (equation 1) f osc : osc frequency [hz] c osc : osc capacitance [f] i dosc : osc discharge current [a] (typ 11a) i cosc : osc charge current [a] (typ - 11a) v osch : osc high voltage [v] (typ 3.6v) v oscl : osc low voltage [v] (typ 1.5v) (ex.) the frequency when motor output pwm operates becomes abo ut 26.2 khz when assuming that cosc is 100pf. f osc =|11 x 10 -6 x -11 x 10 -6 | / (100 x 10 - 12 x (|11 x 10 -6 | + |-11 x 10 -6 |) x (3.6-1.5)) = 26.2 x 10 3 [hz] (equation2) 2. limit on duty at start- up and function selector (1) limit on duty at start- up in the application circuit of speed control by dc voltage input, limit on duty at start up function can reduce the rush current of the motor. it is driven by a constant outp ut duty (d ohl ; typ 53%) within a given period of time (t ohl ; typ 0.5 s) . when sel is low (pull-down to gnd using r< 10k ) and th voltage is less than 3.6v (typ) , limit on duty at start up function operates under the following cond ition s: (a) power on (b) quick start (c) lock release , lock detection on time (t on ) (d) standby release (2) function select or of limit on duty function of limit on duty at start up can be set (disable or enab le) using the sel terminal. please refer to the timing chart (figure 56 , 61, 62 ) for each function. (a) sel = open (pull up to internal reg); limit on duty at start- up di sable (b) sel = low ( pull down to gnd using r< 10k ); limit on duty at start-up enable figure 56. timing chart of power on figure 55. characteristic of limit on duty at start- up figure 57. select function in the dc voltage input application sel function selector control logic duty limit start- up sel =open limit on duty at start- up : disable disable open internal reg sel function selector control logic duty limit start- up sel =pull down to gnd limit on duty at start- up : enable en able pull down to gnd to 10k internal reg figure 54. setting of the variable speed function ng th pull down setting (prohibit input) min ref th min ref pull up setting (torque offsetting) ok th min ref setting less than osc high level (torque on setting) ok th min ref ng open setting (prohibit input) t ohl (t yp 0. 5s) off on 0% input torque motor output on duty duty limit power on :limit on duty at start- up power supply d ohl (t yp 53 %) d ohl (typ 53%) 1.5 motor output on duty[%] 100 0 53 3.6 th voltage [v] v th d oh 2.49 downloaded from: http:///
19 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 3. start duty assist and duty selector (1) start duty assist in the application circuit of speed control by pulse input, start duty assist can secure a constant starting torque even at low duty. the ic is driven by a constant output du ty (d ohs1 ; typ 33% or d ohs2 ; typ 53%) within a given period of time (typ 0. 25 s). when th voltage more than ref-0.1v and min voltage is less than 3.6v (typ) , start duty assist function operates under the following condition s: (a) power on (b) quick start (c) lock release, lock detection on time (ton) (d) standby release when the motor rotates, this function is released even if in this time. (2) duty selector of start duty assist function of start duty assist can be set to either 53% o r 33% using the sel terminal. please refer to the timing chart (figure 59 , 62 , 63 ) for each function. (a) sel = open (pull up to internal reg ); duty 53% (b) sel = low (pull down to gnd using r< 10k ); duty 33% (3) relation with limit on duty function as shown in table1, the function changes depending on the setting of sel terminal and the two speed control applications. table 1. speed control application and sel terminal setting speed control application sel terminal open 10k pull down to gnd dc voltage input (thref-0.1 v) start duty assist : 53% start duty assist : 33% figure 60. duty select in the pulse input application figure 59. timing chart of power on figure 58. characteristic of start duty assist off on 0% input torque motor output on duty duty assist. power on :start duty assist power supply t yp 0.25 s d ohs (t yp 53% or 33%) d ohs (t yp 53% or 33%) 0 motor output on duty[%] 100 0 53 100 min on duty [% ] d min d oh 50 33 pull down t o gnd to 10k sel function selector control logic start duty assist sel =pull down to gnd: start duty assist 33% duty 33% internal reg sel function selector control logic start duty assist sel =open: start duty assist 53% duty 53% open internal reg downloaded from: http:///
20 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 4. quick start when torque off logic is input by the control signal ove r a fixed time (1.0ms), the lock protection function is disable d. the motor can restart quickly once the control signal is applied . lock alarm signal (al) at the time of the quick start maint ains the logic of the al signal just before the quick start standby. but when al signal begins quick start standby i n hi-z and a hall input signal is replaced during quick start standby later, al signal is changed to l from h. the lock protection function doesn t work with an input frequency slower than 1 khz assuming h igh level duty = 10 0% of the min input signal. input signal frequency must be faster t han 2 khz. figure 61. quick start timing chart (dc input application) figure 62. quick start timing chart (pulse input application) t ohl (t yp 0.5s) disable enable th 3.6v low high h+ h C 0% typ 1.0ms torque off motor stop torque on lock protection signal motor idling quick start standby mode 0% duty limit :limit on duty enable input torque input torque motor output on duty (sel=open or th> 2. 49 v) motor output on duty (sel<0.8v and th< 2. 49 v) d ohl (typ 53 %) ty p 0.25s typ 0.25s d ohs1 (typ 33%) disable enable min low high low high h+ h C typ 1.0ms torque off motor stop torque on lock protection signal motor idling quick start standby mode 0% :start duty assist input torque motor output on duty (sel=open) 0% input torque motor output on duty (sel<0.8v) duty assist. duty assist. d ohs2 (typ 53%) downloaded from: http:///
21 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 5. lock protection and automatic restart motor rotation is detected by hall signal and the ic internal counter set lock detection on time (t on ) and off time (t off ). timing chart is shown in figure 63. 6. hall input setting (1) hall input setting hall input voltage range is shown in operating conditions (p.1). adjust the value of hall element bias resistor r 1 in figure 65 so that the input voltage of a hall ampl ifier is input in "hall input voltage range" includi ng signal amplitude. (2) reducing the noise of hall signal v cc noise or the like depending on the wiring pattern of boa rd may affect hall element. in this case, place a capacitor like c 1 in figure 65 . in addition, when wiring from the hall element output to ic hall input is long, noise may be loaded on wiring. in this case, place a capacitor like c 2 . h C hb h+ hall hall amp hall comp c 1 c 2 r 1 r h i h hall bias current; i h [a] = vhb[v] / (r h +r 1 )[ ] hall bias figure 63. lock protection (incorporated counter system) timing chart figure 65. hall input application figure 64. hall input voltage range motor output on duty (sel=open or th> 2. 49 v) motor output on duty (sel<0.8v and th< 2. 49 v) out1 out2 h+ h C low high low high high motor lock low high 0% input torque t off (t yp 5.0s) t off motor idling lock detection lock release : high impedance 0% duty limit :limit on duty :start duty assist 53% or 33% ` t ohl (t yp 0.5s) t on (t yp 0.5s) t on input torque t on t off fg low high al low motor output on duty (th=ref and min<3.6 v) 0% duty assist. typ 0.2 5s input torque 0 .4 v hall input upper limit h+ h C operating hall input voltage range hall input lower limit h+ h C 3v (vcc>9v) vcc/3v (vcc<9v) downloaded from: http:///
22 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 7. btl soft switching function (silent drive setting) (1) motor output slope by the hall input amplitude input signal to hall amplifier (h+, h C ) is amplified to produce an output signal (out1, out2). when the hall element amplitude is small, the slope o f the output waveform is gentle. when it is large, the slop e of the output waveform is steep. gain of 48.5db (2 70 times) is provided between input and output, therefore, an appropriate hall element input signal must be applied to the ic such that output waveform s wings. an input of more than 150mvpp (hall amplitude difference conversion) is recommended. (2) drive system at dc voltage input at the speed controll ed by the dc voltage input to th terminal, BD6994FV automaticall y adjusts the regeneration section during phase change of output dependi ng on th voltage. as a result, the motor becomes closer to h bridge drive at high speed rotation, and contributes to low er power consumption figure 66. hall input amplitude and the motor output waveform figure 67. th voltage and motor output waveform (pwm by the th voltage i s omitted for a functional description) small large h+ h C mid. small large mid. out1 out2 low high low high 0a hall amplitude ; large hall amplitude; middle hall amplitude; small motor current h+ h C out1 out2 low high low high 0a rotate at high speed (0.2v < th < 1.5v) rotate at middle speed (1.5v < th < 2.0v) rotate at low speed (2.0v < th < 3.6v) motor current downloaded from: http:///
23 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 functional descriptions 8. stand- by when l logic of ps pin is input by the control signal over a fi xed time (1.0ms), the ic will be in stand-by mode. in stand-by mode, al signal becomes l logic and fg signal bec omes hi-z logic. when h logic of ps pin is input by the control signal, the ic is in normal drive mode. when al pin is not used in stand-by mode, the motor current becom es 160ua (v cc =12v,typ). when ps pin is used like in the application circuit example , use push-pull pwm signal input. pwm signal input of the open drain / collector cannot be used. because internal resistance (200k: pull up to int ernal reg) is high, using open drain / corrector is not enough for speed of h input. high low ps low high h+ h C typ 1.0ms torque off motor stop torque on ref/hb motor idling ? stand- by out1 out2 fg low low low high high high off figure 68.stand-by timing chart downloaded from: http:///
24 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 safety measure 1. reverse connection protection diode reverse connection of power results in ic destruction as shown in figure 69 . when reverse connection is possible, reverse connection protection diode must be added between pow er supply and vcc. 2. measure against v cc voltage rise by back electromotive force back electromotive force (back emf) generates regenerative curren t to power supply. however, when reverse connection protection diode is connected, v cc voltage rises because the diode prevents current flow to po wer supply. when the absolute maximum rated voltage may be exceede d due to voltage rise by back electromotive force, place (a) capacitor or (b) zener diode between vcc and gnd. if necessary, add both (c). 3. problem of gnd line pwm switching do not perform pwm switching of gnd line because gnd terminal potential c annot be kept to a minimum. 4. protection of rotation speed pulse (fg) and/or lock alarm (al) o pen -drain output fg and/or al output is an open drain and requires pull-up res istor. adding resistor can protect the ic. exceeding the absolute maximum rating, when fg and/or al terminal is directly co nnected to power supply, could damage the ic. figure 69. flow of current when power is connected reversely figure 70. vcc voltage rise by back electromotive force figure 71. measure against v cc and motor driving outputs voltage rise at regenerative braking figure 72. gnd line pwm switching prohibited figure 73. protection of fg/al terminal i/o v cc gnd in normal energization internal circuit impedance is high ? amperage small circuit block i/o gnd reverse power connection large current flows ? thermal destruction circuit block v cc i/o gnd after reverse connection destruction prevention no destruction circuit block v cc on phase switching on on on on on on on on on (a) capacitor (b) zenner diode (c) capacitor & zenner diode vcc gnd prohibit motor driver controller pwm input m fg driver al protection resistor motor unit pull- up resistor sig connector downloaded from: http:///
25 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 power consumption 1. current pathway the current pathways that relates to driver ic are the following, and shown in figure 74. (1 ) circuit current (i cc ) (2 ) motor driving current (i m ) (3) reference bias current to the lpf and resistors (i ref ) (4 ) hall bias current to the hall element (i hb ) (5) fg (al) output sink current (i so ) 2. calculation of power consumption (1 ) circuit current (icc) p w(a) = v cc x i cc [w] (equation3) p w(a) : power consumption [w] v cc : v cc voltage [v] i cc : circuit current [a] (expect hall bias current (i hb )) (2 ) motor driving current (i m ) p w(b) = ((v oh +v ol ) x im) x t2/t1 + (i cha n ge / 2 x v cc / 4 ) x t3/ t1 [w] (equation4) p w(b) : power consumption [w] v oh : output high voltage [v] v ol : output low voltage [v] i m : motor driving average current [a] i change : motor driving current of btl initiation [a] (3 ) reference bias current to the lpf and resistors (i ref ) p w(c) = (v cc - v ref ) x i ref [w] (equation5) p w(c) : power consumption [w] v ref : ref voltage [v] i ref : ref bias current [a] (4 ) hall bias current to the hall element (i hb ) p w(d) = (v cc - v hb ) x i hb [w] (equation6) p w (d ) : power consumption [w] v hb : hall bias voltage [v] i hb : hall bias current [a] (5) fg (al) output sink current (iso) p w(e) = v so x i so [w] (equation7) p w(e) : power consumption [w] v so : fg (al) output l ow voltage [v] i so : fg (al) output sink current [a] total power consumption of driver ic becomes the following by the above (1 ) to (5). p w(ttl) = p w(a) + p w(b) + p w(c) + p w(d) + p w(e) [w] (equation8) (ex.) p w(a) = 12 x 6.5 x 10 -3 [w] (equation9) p w(b) = ((0.37 + 0.23) x 0.4) x 9/10 + (0.4/2 x 12/4) x 1/10 [w] (equation10) p w(c) = (12 - 5.1) x 2.0 x10 -3 [w] (equation11) p w(d) = (12 - 1.25) x 3.5 x 10 -3 [w] (equation12) p w(e) = 0.2 x 5.0 x 10 -3 [w] (equation13) p w(ttl) = 0. 406 [w] (equation14) refer to next page when you calculate the chip surface tempe rature (tj) and the package surface temperature (tc) by using the power consumption value. figure 74. current pathway of ic m sig h pwm sig i hb i so i m i cc i ref hall a mp hall comp min th out1 fg osc v cc out2 gnd hb h C ref sel gnd h+ al ps 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 pwm comp pwm comp internal reg 14 osc ref hall bias signal output tsd lock protect quick start control logic function selector hall a mp standby h+ h C out1 out2 t2 t3 t1 im i change figure 75. motor driving current for calculation downloaded from: http:///
26 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 power dissipation 1. power dissipation power dissipation (total loss) indicates the power that can be con sumed by ic at ta=25c (normal temperature). ic is heated when it consumes power, and the temperature of ic chip bec omes higher than ambient temperature. the temperature that can be accepted by ic chip into the package, that i s junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, e tc . power dissipation is determined by this maximum joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature. therefore, when a power dissipation exceeds the absolute maxim um rating, the operating temperature range is not a guarantee. the maximum junction temperature is in general equal to the maximum value in the storage temperature range. 2. thermal resistance heat generated by consumed power of ic is radiated from the mo ld resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardnes s of heat release) is called thermal resistance. in the s tate of the substrate mounting, thermal resistances from the chip j unction to the ambien ce and to the package surface are shown respectively with ja [ c /w] and jc [c/w]. thermal resistance is classified into the packag e part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. on the other hand, thermal resis tance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the c opper foil area etc. therefore, thermal resistance can be decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate. the thermal resistance model and calculations are shown in figure 76 , and equation 15 and 16 , respectively. where: ja is the thermal resistance from the chip junction to the ambien ce j c is the thermal resistance from the chip junction to the package surface tj is the junction temperature ta is the ambient temperature tc is the package surface temperature p is the po wer consumption even if it uses the same package, thermal resistance ja and jc are changed depending on the chip size, po wer consumption, and the measurement environments of the ambi ent temperature, the mounting condition, and the wind velocity, etc. th ermal resistance under a certain regulated condition is shown in table 2 as a reference data when the fr4 glass epoxy substrate (70mm x 70mm x 1.6mm and 3% or less in th e area of the copper foil) is mounted. rohm standard (note 1) one-layer unit ja 14 2.9 c /w jc 36 c /w (note 1) mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board 3. thermal de-rating curve thermal de-rating curve indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic be gins to attenuate at certain ambient temperature (25c), and becomes 0w at the maximum joint temperature (150c). the inclination is reduced by the reciprocal of thermal resistance ja. the thermal de -rating curve under a certain regulated condition is shown in figure 77 . figure 76. thermal resistance model of surface mount table 2. thermal resistance (reference data) jc [c /w ] chip surface temperature: tj[c] package surface temperature: tc[c] ambient temperature: ta[ c ] ja [c /w ] mouting substrate 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 150 ambient temperature: ta[c] power dissipation: pd[w] operating temp range figure 77. power dissipation vs ambient temperature (mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy substrate) - 1/ ja=-7.0mw/c ja = (tj - ta) / p [c/w] (equation 15) jc = (tj - tc) / p [c/w] (equation 16) downloaded from: http:///
27 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 i/o equivalence circuit (resistance values are typical) 1. power supply terminal, 2. hall input terminals, 3. motor output pins 4. reference voltage and ground terminal output duty controllable input ou tput and hall bias pin pin, and minimum output duty setting pin 5. duty control start up function 6. o scillating capacitor 7. speed pulse signal output pin 8. power save pin setting pin connecting pin and lock alarm signal output pin vcc out1 out2 vcc gnd ref vcc hb osc vcc 1k 1k sel 10k 150k internal reg internal reg 5 fg al th 1k h+ h C min ps 10k 200 k internal reg internal reg downloaded from: http:///
28 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the us er should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and condition s such as motor characteristics, supply voltage, operating freque ncy and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of th e application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the gro und traces of external components do not cause variations on the ground voltage the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the power dissipation stated in this datasheet is when the ic is mounted on a 70mm x 70mm x 1 .6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper are a to raise heat dissipation capability. 6. recommended operating conditions th ese conditions represent a range within which the expecte d characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, width of power and ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a c apacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. to prevent damage from static discharge, ground the ic during assembly and use s imilar precautions during transport and storage. the ics power supply should always be turned off completely befor e connecting or removing it from the test setup during the inspection process. 10. mounting errors and inter-pin short ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
29 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 operational notes 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significan t effect on the conduction through the transistor and cause unexpected operation of the ic. especially, if it is not express ed on the datasheet, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasiti c diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to a n input pin (and thus to the p substrate) should be avoided. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown (tsd) circuit this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rati ng is exceeded for a continued period, the junction temperature will rise which will activate the tsd circuit that will turn off all output pins. when the junction temperature falls below the tsd threshold, the circuits are automatical ly restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set de sign or for any purpose other than protecting the ic from heat damage. figure 78. example of monolithic ic structure n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
30 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 physical dimension, tape and reel information package name ssop-b16 downloaded from: http:///
31 / 31 BD6994FV ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0h1h0b101220-1-2 13.jul.2015 rev.002 ordering information marking diagram revision history date revision comments 18.may.2015 001 new release 13.jul.2015 002 change of ordering information d 6 9 9 4 ssop-b16 (top view) part number lot number 1pin mark b d 6 9 4 f g part number package ? fv ; ssop-b 16 v ? g;halogen free packaging and forming specification - 9 2 e ? e2 ;embossed tape and reel downloaded from: http:///
datasheet datasheet notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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